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Resist System for Fine Pattern Circuit Formation (ReFiiP)
It is Possible to Achieve Further High Definition by Uniform Thinning Process of Resist
Want for More Fine Pitch!

Example of Usage

Example of Usage

Thinning Uniformity(Distribution in Panel)

upper side
under side

Necessity and Advantage of ReFiP

Adhesion and Followingness

Following Test for Concave and Convex Board

Groove Depth : 10µm
Groove Width : 20µm
Resist Thickness : 40µm -> 7µm

Excellent Contact to Rough Surface

Tenting Reliability

Thick Resist is Formed only in Tenting Part

Resist Thickness
　Tenting Part : 30µm
　Wiring Part : 10µm

Tenting Reliability

Fine Resolution

Fine Resolution in Resist Thickness Min. 2µm

Fine Resolution
Photoresist system, other
Resist System for Fine Pattern Circuit FormationNew Solder Resist Formation System
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