Excellent Adhesion to Metal Substrate
MS9xxx Series has Excellent Adhesion to Metal Substrates(e.g. SUS, Copper).
Also the DFR has Excellent Resistance Against Chemical Etchant.
Excellent Resist-Stripping Performance
In Stripping Process, MS9xxx is Crumbled to Small Fragments, and Fragments are Soluble in Sodium Hydroxide Stripper.
Because of these Features, Using MS9xxx Decreases Troubles that are Caused by Stripped DFR and Improves Manufacturing Yield.
Specification
| Type | Resist Thickness |
|---|---|
| MS9050 | 50µm |
| MS9025 | 25µm |
